Asia
TSMC issues NT $ 13.9 billion in green bonds
trentboult4 mins ago
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Taipei, July 18 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chip maker, on Monday with 13.9 billion Taiwan in unsecured company Green Bond to fund green building construction and other eco. Announced plans to issue dollars (US $ 464.49 million). Friendly project.
According to TSMC, a NT $ 13.9 billion worth of green bonds will consist of four tranches, including a four-year NT $ 1.2 billion tranche with a coupon rate of 1.6% and a five-year NT $ 10.1 billion tranche with a coupon rate of 1.7%. .. ..
In addition, the company said a 7-year tranche worth NT $ 1.2 billion will be offered at a coupon rate of 1.75% and a 10-year tranche worth NT $ 1.4 billion at a coupon rate of 1.95%.
The chip maker said it plans to outsource SinoPac Securities Corp. as the primary underwriter for the issuance and use the proceeds to capital on green building and other projects aimed at improving the environment.
On February 15, the TSMC Board approved plans to issue up to NT $ 60 billion in unsecured bonds in Taiwan to fund capacity expansion and pollution control initiatives.
According to the company, the NT $ 13.9 billion corporate bond will be TSMC’s fourth green bond issue this year.
https://focustaiwan.tw/business/202207180023 TSMC issues NT $ 13.9 billion in green bonds
